RS PRO Wire, 0.81mm Lead Free Solder, 228°C Melting Point
8007677
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LSG Stock No.: | 8007677 |
---|---|
Weight | 0.250000 |
Product document | "pdf_file_07a3e77e337534d3f642" |
Mfr. Part No.: | 800-7677 |
Sub Cat 1 | Welding |
Sub Cat 2 | Soldering Tools and Equipment |
Sub Cat 3 | Solders |
General Name | Lead Free Solder |
Shipping Type | bulilit |
UOM | Each |
Item Packaging | 1 |
Manufacturer | RS Pro |
Product Availability | The standard Lead time of this Product is 2-3 weeks |
RS PRO Low-Cost Lead-Free Solder Wire
From the trusted RS PRO brand, this solder wire is a resin-based, SAC305 lead-free solder wire that utilises a synthetically refined resin and effective activator package.
The flux formulation of this solder wire is ideal for wetting common Printed Circuit Boards (PCBs) and any components as it leaves behind a clear residue that can be easily removed with dry brushing for a cleaner look or safely left on the PCB after soldering.
The alloy used in this solder wire conforms to J-STD 006 and contains 96.5% tin, 3.0% silver and 0.5% copper.
• 800-7677 is a 0.8mm 250g lead-free solder supplied on a reel
• 800-7668 is a 1.2mm 250g lead-free solder supplied on a reel
• 800-7664 is a 1.0mm 250g lead-free solder supplied on a reel
• 800-7630 is a 1.0mm 500g lead-free solder supplied on a reel
• 800-7636 is a 0.25mm 250g lead-free solder supplied on a reel
• 818-3204 is a 0.8mm lead-free solder supplied in a 4m handy pack
Features and Benefits
• Versatile solder wire that is suitable for a wide range of soldering tasks
• Typical temperature of soldering iron tip for use with this solder is 360-400°C
• Melting point is 217-219°C
• Flux content 3.3%
Applications
Solder is used alongside soldering irons, particularly in securing electrical components to integrated circuit boards. The solder melts easily when heated, and cools quickly, meaning it can be moulded to secure components in place in solder joints. The quick setting nature of solder means it can also be used for light brazing.
Because of its relatively low melting point, solder can be reworked easily by heating it to melting point and using a solder sucker to remove it.
Solder is commonly used with SMD and through-hole components, with applications in repair, prototyping and production.
What are the differences between lead-free solder and leaded solder?
Lead-free solder is generally regarded as having a more positive environmental impact than leaded solder, and also as being safer for human use. However, lead-free solder also has potential production advantages. Lead-free solder can offer better lead spacing, which makes it more suitable for high-density components where pitches are tight. This means potentially better performance where space saving is a concern.
The advantages of lead solder are that it has a lower melting point, which is sometimes preferable for hand working components. Also, lower working temperatures reduces the risk of damage to components and circuit board.
Unlike lead-free solder, lead solder does not have a shelf-life and is less prone to losing quality after prolonged exposure to oxygen. However, many electronic application requirements exclude the use of lead solder, due to the toxicity of lead.
Wire Diameter: 0.81mm
Model Number: NC600 SN100E
Percent Lead: 0%
Product Form: Wire
Melting Point: 228°C
Percent Tin: 99.5%
Flux Type: Rosin Based
Product Weight: 250g
Flux Content Percent: 3.3%
Percent Copper: 0.5%
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